EAI SmartGIFT 2023 will be held as an on-site conference and if needed, Accepted Authors who are unable to attend the event in person will be given an option to present remotely.
Scope
The 8th EAI International Conference on Smart Grid and Innovative Frontiers in Telecommunications (SmartGIFT) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of Smart Grid and Telecommunications. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in Smart Grid and Telecommunications.
Welcome to the EAI Community
Let the EAI Community help you build your career with collaborative research, objective evaluation, and fair recognition:
- Get more visibility for your paper and receive a fair review with Community Review,
- Earn credits regardless of your paper’s acceptance and increase your EAI Index for new membership ranks and global recognition,
- Find out if your research resonates – get real-time evaluation of your presentation on-site via EAI Compass.
Topics
We welcome contributions from the following fields:
Smart grid related topics:
- Artificial intelligence in smart grid
- Trust and privacy in smart grid
- Fair and equitable AI for smart grid
- Energy Storage and Resource Management for Smart Grid
- Modelling and simulation of smart grid
- Operation analysis and optimization of smart grid
- Data analytics, sensing, processing and communication techniques for smart grid
- Renewable & Sustainable Energy Technologies
- Flexibility and self-healing capability of smart grid
- Quality-of-Service (QoS), energy-efficiency, and fault tolerance in smart grid systems
- Smart grid electricity markets
- Smart grid scheduling load batch control
Telecommunications related topics:
- 5G and beyond enabling technologies, innovative applications and services
- Communication protocols for real-time data acquisition and remote control
- Data models and communication-aware data management solutions
- Internet of things for smart cities
- Machine learning / deep learning in telecommunications
- Physical / MAC layer protocols, low power link layer technologies (PLC and wireless)
- Resource management and cross-layer optimization
- Scalable network and system architecture (e.g., FAN, HAN, NAN and BAN)
- Signal processing and coding techniques for energy related sensor information
- Software defined wireless networks
- Multi-hop communication and mesh networking
- Intelligent power load control, monitoring and optimization
- Device Management and Online Monitoring for Smart Grid
Publication
All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.
Proceedings will be submitted for inclusion in leading indexing services, such as Web of Science, Compendex, Scopus, DBLP, EU Digital Library, Google Scholar, IO-Port, MathSciNet, Inspec, and Zentralblatt MATH.
Additional publication opportunities:
- EAI Transactions series (Open Access)
- EAI/Springer Innovations in Communications and Computing Book Series
(titles in this series are indexed in Ei Compendex, Web of Science & Scopus)
Paper submission
Papers should be submitted through EAI ‘Confy+‘ system, and have to comply with the Springer format (see Author’s kit section).
- Regular papers should be up to 12-15+ pages in length.
- Short papers should be 6-11 pages in length.
All conference papers undergo a thorough peer review process prior to the final decision and publication. This process is facilitated by experts in the Technical Program Committee during a dedicated conference period. Standard peer review is enhanced by EAI Community Review which allows EAI members to bid to review specific papers. All review assignments are ultimately decided by the responsible Technical Program Committee Members while the Technical Program Committee Chair is responsible for the final acceptance selection. You can learn more about Community Review here.